Post by williamplayer on Jan 20, 2014 12:56:05 GMT
Made in IBM Labs: Researchers Demonstrate Future of Computing with Graphene, Racetrack and Carbon Nanotube Breakthroughs
Prototypes developed for first time in real-world manufacturing environments are critical step towards transferring research into commercial devices.
Today at IEEE International Electron Devices Meeting, IBM (NYSE: IBM) scientists unveiled several exploratory research breakthroughs that could lead to major advancements in delivering dramatically smaller, faster and more powerful computer chips.
For more than 50 years, computer processors have increased in power and shrunk in size at a tremendous rate. However, today’s chip designers are hitting physical limitations with Moore’s Law, halting the pace of product innovation from scaling alone.
With virtually all electronic equipment today built on complementary-symmetry metal–oxide–semiconductor (CMOS) technology, there is an urgent need for new materials and circuit architecture designs compatible with this engineering process as the technology industry nears physical scalability limits of the silicon transistor.
Following years of key physics advances previously only achieved in a laboratory, IBM scientists successfully integrated the development and application of new materials and logic architectures on 200mm (eight inch) diameter wafers. These breakthroughs could potentially provide a new technological basis for the convergence of computing, communication, and consumer electronics.
Read Full Article: www-03.ibm.com/press/us/en/pressrelease/36135.wss
Prototypes developed for first time in real-world manufacturing environments are critical step towards transferring research into commercial devices.
Today at IEEE International Electron Devices Meeting, IBM (NYSE: IBM) scientists unveiled several exploratory research breakthroughs that could lead to major advancements in delivering dramatically smaller, faster and more powerful computer chips.
For more than 50 years, computer processors have increased in power and shrunk in size at a tremendous rate. However, today’s chip designers are hitting physical limitations with Moore’s Law, halting the pace of product innovation from scaling alone.
With virtually all electronic equipment today built on complementary-symmetry metal–oxide–semiconductor (CMOS) technology, there is an urgent need for new materials and circuit architecture designs compatible with this engineering process as the technology industry nears physical scalability limits of the silicon transistor.
Following years of key physics advances previously only achieved in a laboratory, IBM scientists successfully integrated the development and application of new materials and logic architectures on 200mm (eight inch) diameter wafers. These breakthroughs could potentially provide a new technological basis for the convergence of computing, communication, and consumer electronics.
Read Full Article: www-03.ibm.com/press/us/en/pressrelease/36135.wss